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Brand Name : Suntek
Model Number : SRIF0326RI
Certification : ISO9001, ISO13485, TS16949 and UL E476377
Place of Origin : China/Cambodia
MOQ : 5pcs
Price : USD+1-100+PCS
Payment Terms : T/T,Paypal
Supply Ability : 100pcs/hour
Delivery Time : 1 week after all components collected
Packaging Details : 60*40*30cm cartons and ESD bags
Material : FR4 TG130 TG170 TG180
Color : Red,Green,Black,Purple,White
Layer : 1-30L
Size : 100*200mm,1200*400mm,200*400mm
Surface Finishing : Electroplate Ni/Au(Flash gold/Soft gold/Hard gold), ENIG, HASL, Immersion Tin,OSP
package : 0201 0603 0805 2410 BGA QFN DFN
Test : AOI,ICT,100% Visual Inspection,FT
Blind or Buried Vias : Yes
Impedance Control : Yes
Copper thickness : 8 OZ
OEM ODM PCB Assembly board High Efficiency Productivity Imm Gold With BGA
We have advanced manufacturing equipments,professional technology, professional engineer team,purchasing team,quality team and well trained operators to make sure the PCB assembly product with good&stable quality.
SMT Parameters:
Technology | Circuit | PCB/Flex/Metal PCB/Rigid-Flex | Parameter | Assembly Side | Single/Double |
Process | SMT | Min Size | 10mm * 10mm | ||
THT | Max Size | 410mm * 350mm | |||
Punch | Thickness | 0.38mm ~ 6.00mm | |||
In-circuit Test Function Test | Min Chip | 0201 chip | |||
Glue,Burn-in Conformal Coating | Fine-pitch | 0.20mm | |||
BGA Re-work | BGA ball size | 0.28mm |
Technology Involved:
Item | Capability |
Min.Finished Board Thickness | 0.05mm |
Max Board Size | 500mm*1200mm |
Min Laser Drilled Hole Size | 0.025mm |
Min Mechanical Drilled Hole Size | 0.1mm |
Min. Trace Width/Spacing | 0.035mm/0.035mm |
Min.Annular Ring of Single/Double-side Board | 0.075mm |
Min.Inner Layer Annular Ring of Multi-layer Board | 0.1mm |
Min.Outer Layer Annular Ring of Multi-layer Board | 0.1mm |
Min Coverlay Bridge | 0.1mm |
Min. Soldermask Opening | 0.15mm |
Min.Coverlay Opening | 0.35mm*0.35mm |
Min Single-ended Impedance Tolerance | +/-7% |
Min Differential Impedance Tolerance | |
Max Layer Count | 12L |
Material Type | PI,Kapton |
Material Brand | Shengyi,Taiflex,Thinflex,ITEQ,Allstar,Panasonic,Dupont,Jiujiang |
Stiffener Material Type | FR4,PI,PET,Steel,AI,Adhesive Tape,Nylon |
Coverlay Thickness | 12.5um/25um/50um |
Surface Finish | ENIG,ENEPIG,OSP,Gold Plating,Gold Plating+ENIG,Gold Plating+OSP,Imm Silver,Imm Tin,Plating Tin |
Special Technology Involved:
◆ IC Programming
◆ BGA rework
◆ Chip on Board/COB
◆ Eutectic soldering
◆ Auto-Gluing
◆ Conformal Coating
Assemly Flow Chart:
Suntek Group is a leading supplier in EMS field with one-stop solution for PCB/FPC assembly,Cable assembly,Mix technology assembly and Box-buildings.
Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;
BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.With ISO9001:2015,ISO13485:2016,IATF 16949:2016 and UL E476377 certified,.We deliver qualified products with competitive price to clients all over the world.
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Industrial Control PCBA SMT THT AOI X-WAY FT With FR4 TG130 TG170 TG180 Images |